Integration of Jet Impingement Cooling With Direct Bonded Copper Substrates for Power Electronics Thermal Management

Thermal Performance of Jet Impingement with Spent Flow Management

The present study proposes novel micro-jet impingement heat sink with effusion holes for flow extraction. The design consists of impingement nozzles surrounded by multiple effusion holes to take away the spent fluid. A three-dimensional numerical model is used for steady, incompressible, laminar flow and conjugate heat transfer for the performance analysis of the proposed design. The computatio...

Smart Integration of Thermal Management Systems for Electronics Cooling

Direct Low - Temperature Integration of Nanocrystalline Diamond with GaN Substrates for Improved Thermal Management of High - Power Electronics

make GaN a superior material to Si and GaAs for the hightemperature high-power electronic devices, ultrahigh power switches, and microwave-power sources. [ 3 ] However, self-heating limits the performance of GaN devices and further development of GaN technology. [ 4 , 5 ] The temperature rise in high-power AlGaN/GaN heterostructure fi eld-effect transistors (HFETs), which is currently on order ...

Microjet Cooling Devices for Thermal Management of Electronics

This research is an effort to demonstrate the applicability of miniaturized synthetic jet (microjet) technology to the area of thermal management of microelectronic devices. Synthetic jets are jets which are formed from entrainment and expulsion of the fluid in which they are embedded. Design issues of microjet cooling devices are discussed along with characterization of excitation elements and...

Effects of jet pattern on single-phase cooling performance of hybrid micro-channel/micro-circular-jet-impingement thermal management scheme

This study explores the single-phase cooling performance of a hybrid cooling module in which a series of micro-jets deposit coolant into each channel of a micro-channel heat sink. This creates symmetrical flow in each micro-channel, and the coolant is expelled through both ends of the micro-channel. Three micro-jet patterns are examined, decreasing-jet-size (relative to center of channel), equa...